Stress situation at interconnect
Stress situation at sealing structure
3D Capacitor Structures
PinFin Array
3D Capacitor Structures


The Project CarrICool - Modular Interposer System Architecture providing scalable Heat Removal, Power Delivery and Optical Signaling is running within EU’s Seventh Framework Programme for Research (FP7).

7o-programa-quadro-logo2_kleinCarrICool will deliver a game-changing 3D packaging platform for scale-up of future, many-core, exascale computing systems. The project will also develop a strategic supplier base in Europe for high-end HPC components and systems integration capabilities in the Exascale era.

  • Framework/Project Objective: FP7-ICT-2013.3.1 (Nanoelectronics)
  • Project number: 619488
  • Project start: 01.01.2014
  • Duration: 3 years
  • Partners: IBM Research GmbH, Fraunhofer Institute for Reliability and Microintegration IZM, Technical University of Chemnitz, Tyndall National Institute/ University College Cork, Optocap Ltd, IPDIA, Eidgenoessische Technische Hochschule Zuerich, Institute of Electron Technology, AMIC Angewandte Micro-Messtechnik GmbH