Stress situation at sealing structure
credit TU Chemnitz (click on image for full picture)
Autoren-Archiv: Claudia Brall
Stress situation at interconnect
credit TU Chemnitz (click on image for full picture)
3D Capacitor Structures
credit IPDiA (click on image for more)
3D Capacitor Structures
credit IPDiA (click on image for more)
PinFin Array
Silicon interposer with pin fin array and TSVs (credit IBM Research)
Inductor
Helical inductor (credit IBM Research)
Microchannel
Silicon interposer with microchannels and TSVs (credit IBM Research)
FluidCavity
Fluid flow through pin fin array (credit IBM Research)